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不错的信号完整性英文书籍(Eric Bogantin)

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发表于 2010-7-13 11:32:25 | 显示全部楼层 |阅读模式
很不错的信号完整性英文书籍

     Chapter 1.  Signal Integrity Is in Your Future
        Section 1.1.  What Is Signal Integrity?
        Section 1.2.  Signal Quality on a Single Net
        Section 1.3.  Cross Talk
        Section 1.4.  Rail-Collapse Noise
        Section 1.5.  Electromagnetic Interference (EMI)
        Section 1.6.  Two Important Signal Integrity Generalizations
        Section 1.7.  Trends in Electronic Products
        Section 1.8.  The Need for a New Design Methodology
        Section 1.9.  A New Product Design Methodology
        Section 1.10.  Simulations
        Section 1.11.  Modeling and Models
        Section 1.12.  Creating Circuit Models from Calculation
        Section 1.13.  Three Types of Measurements
        Section 1.14.  The Role of Measurements
        Section 1.15.  The Bottom Line

     Chapter 2.  Time and Frequency Domains
        Section 2.1.  The Time Domain
        Section 2.2.  Sine Waves in the Frequency Domain
        Section 2.3.  Shorter Time to a Solution in the Frequency Domain
        Section 2.4.  Sine Wave Features
        Section 2.5.  The Fourier Transform
        Section 2.6.  The Spectrum of a Repetitive Signal
        Section 2.7.  The Spectrum of an Ideal Square Wave
        Section 2.8.  From the Frequency Domain to the Time Domain
        Section 2.9.  Effect of Bandwidth on Rise Time
        Section 2.10.  Bandwidth and Rise Time
        Section 2.11.  What Does "Significant" Mean?
        Section 2.12.  Bandwidth of Real Signals
        Section 2.13.  Bandwidth and Clock Frequency
        Section 2.14.  Bandwidth of a Measurement
        Section 2.15.  Bandwidth of a Model
        Section 2.16.  Bandwidth of an Interconnect
        Section 2.17.  Bottom Line

     Chapter 3.  Impedance and Electrical Models
        Section 3.1.  Describing Signal-Integrity Solutions in Terms of Impedance
        Section 3.2.  What Is Impedance?
        Section 3.3.  Real vs. Ideal Circuit Elements
        Section 3.4.  Impedance of an Ideal Resistor in the Time Domain
        Section 3.5.  Impedance of an Ideal Capacitor in the Time Domain
        Section 3.6.  Impedance of an Ideal Inductor in the Time Domain
        Section 3.7.  Impedance in the Frequency Domain
        Section 3.8.  Equivalent Electrical Circuit Models
        Section 3.9.  Circuit Theory and SPICE
        Section 3.10.  Introduction to Modeling
        Section 3.11.  The Bottom Line

     Chapter 4.  The Physical Basis of Resistance
        Section 4.1.  Translating Physical Design into Electrical Performance
        Section 4.2.  The Only Good Approximation for the Resistance of Interconnects
        Section 4.3.  Bulk Resistivity
        Section 4.4.  Resistance per Length
        Section 4.5.  Sheet Resistance
        Section 4.6.  The Bottom Line

     Chapter 5.  The Physical Basis of Capacitance
        Section 5.1.  Current Flow in Capacitors
        Section 5.2.  The Capacitance of a Sphere
        Section 5.3.  Parallel Plate Approximation
        Section 5.4.  Dielectric Constant
        Section 5.5.  Power and Ground Planes and Decoupling Capacitance
        Section 5.6.  Capacitance per Length
        Section 5.7.  2D Field Solvers
        Section 5.8.  Effective Dielectric Constant
        Section 5.9.  The Bottom Line

     Chapter 6.  The Physical Basis of Inductance
        Section 6.1.  What Is Inductance?
        Section 6.2.  Inductance Principle #1: There Are Circular Magnetic-Field Line Loops Around All Currents
        Section 6.3.  Inductance Principle #2: Inductance Is the Number of Webers of Field Line Loops Around a Conductor per Amp of Current Through It
        Section 6.4.  Self-Inductance and Mutual Inductance
        Section 6.5.  Inductance Principle #3: When the Number of Field Line Loops Around a Conductor Changes, There Will Be a Voltage Induced Across the Ends of the Conductor
        Section 6.6.  Partial Inductance
        Section 6.7.  Effective, Total, or Net Inductance and Ground Bounce
        Section 6.8.  Loop Self- and Mutual Inductance
        Section 6.9.  The Power-Distribution System (PDS) and Loop Inductance
        Section 6.10.  Loop Inductance per Square of Planes
        Section 6.11.  Loop Inductance of Planes and Via Contacts
        Section 6.12.  Loop Inductance of Planes with a Field of Clearance Holes
        Section 6.13.  Loop Mutual Inductance
        Section 6.14.  Equivalent Inductance
        Section 6.15.  Summary of Inductance
        Section 6.16.  Current Distributions and Skin Depth
        Section 6.17.  High-Permeability Materials
        Section 6.18.  Eddy Currents
        Section 6.19.  The Bottom Line

     Chapter 7.  The Physical Basis of Transmission Lines
        Section 7.1.  Forget the Word Ground
        Section 7.2.  The Signal
        Section 7.3.  Uniform Transmission Lines
        Section 7.4.  The Speed of Electrons in Copper
        Section 7.5.  The Speed of a Signal in a Transmission Line
        Section 7.6.  Spatial Extent of the Leading Edge
        Section 7.7.  "Be the Signal"
        Section 7.8.  The Instantaneous Impedance of a Transmission Line
        Section 7.9.  Characteristic Impedance and Controlled Impedance
        Section 7.10.  Famous Characteristic Impedances
        Section 7.11.  The Impedance of a Transmission Line
        Section 7.12.  Driving a Transmission Line
        Section 7.13.  Return Paths
        Section 7.14.  When Return Paths Switch Reference Planes
        Section 7.15.  A First-Order Model of a Transmission Line
        Section 7.16.  Calculating Characteristic Impedance with Approximations
        Section 7.17.  Calculating the Characteristic Impedance with a 2D Field Solver
        Section 7.18.  An n-Section Lumped Circuit Model
        Section 7.19.  Frequency Variation of the Characteristic Impedance
        Section 7.20.  The Bottom Line

     Chapter 8.  Transmission Lines and Reflections
        Section 8.1.  Reflections at Impedance Changes
        Section 8.2.  Why Are There Reflections?
        Section 8.3.  Reflections from Resistive Loads
        Section 8.4.  Source Impedance
        Section 8.5.  Bounce Diagrams
        Section 8.6.  Simulating Reflected Waveforms
        Section 8.7.  Measuring Reflections with a TDR
        Section 8.8.  Transmission Lines and Unintentional Discontinuities
        Section 8.9.  When to Terminate
        Section 8.10.  The Most Common Termination Strategy for Point-to-Point Topology
        Section 8.11.  Reflections from Short Series Transmission Lines
        Section 8.12.  Reflections from Short-Stub Transmission Lines
        Section 8.13.  Reflections from Capacitive End Terminations
        Section 8.14.  Reflections from Capacitive Loads in the Middle of a Trace
        Section 8.15.  Capacitive Delay Adders
        Section 8.16.  Effects of Corners and Vias
        Section 8.17.  Loaded Lines
        Section 8.18.  Reflections from Inductive Discontinuities
        Section 8.19.  Compensation
        Section 8.20.  The Bottom Line

     Chapter 9.  Lossy Lines, Rise-Time Degradation, and Material Properties
        Section 9.1.  Why Worry About Lossy Lines
        Section 9.2.  Losses in Transmission Lines
        Section 9.3.  Sources of Loss: Conductor Resistance and Skin Depth
        Section 9.4.  Sources of Loss: The Dielectric
        Section 9.5.  Dissipation Factor
        Section 9.6.  The Real Meaning of Dissipation Factor
        Section 9.7.  Modeling Lossy Transmission Lines
        Section 9.8.  Characteristic Impedance of a Lossy Transmission Line
        Section 9.9.  Signal Velocity in a Lossy Transmission Line
        Section 9.10.  Attenuation and the dB
        Section 9.11.  Attenuation in Lossy Lines
        Section 9.12.  Measured Properties of a Lossy Line in the Frequency Domain
        Section 9.13.  The Bandwidth of an Interconnect
        Section 9.14.  Time-Domain Behavior of Lossy Lines
        Section 9.15.  Improving the Eye Diagram of a Transmission Line
        Section 9.16.  Pre-emphasis and Equalization
        Section 9.17.  The Bottom Line

     Chapter 10.  Cross Talk in Transmission Lines
        Section 10.1.  Superposition
        Section 10.2.  Origin of Coupling: Capacitance and Inductance
        Section 10.3.  Cross Talk in Transmission Lines: NEXT and FEXT
        Section 10.4.  Describing Cross Talk
        Section 10.5.  The SPICE Capacitance Matrix
        Section 10.6.  The Maxwell Capacitance Matrix and 2D Field Solvers
        Section 10.7.  The Inductance Matrix
        Section 10.8.  Cross Talk in Uniform Transmission Lines and Saturation Length
        Section 10.9.  Capacitively Coupled Currents
        Section 10.10.  Inductively Coupled Currents
        Section 10.11.  Near-End Cross Talk
        Section 10.12.  Far-End Cross Talk
        Section 10.13.  Decreasing Far-End Cross Talk
        Section 10.14.  Simulating Cross Talk
        Section 10.15.  Guard Traces
        Section 10.16.  Cross Talk and Dielectric Constant
        Section 10.17.  Cross Talk and Timing
        Section 10.18.  Switching Noise
        Section 10.19.  Summary of Reducing Cross Talk
        Section 10.20.  The Bottom Line

     Chapter 11.  Differential Pairs and Differential Impedance
        Section 11.1.  Differential Signaling
        Section 11.2.  A Differential Pair
        Section 11.3.  Differential Impedance with No Coupling
        Section 11.4.  The Impact from Coupling
        Section 11.5.  Calculating Differential Impedance
        Section 11.6.  The Return-Current Distribution in a Differential Pair
        Section 11.7.  Odd and Even Modes
        Section 11.8.  Differential Impedance and Odd-Mode Impedance
        Section 11.9.  Common Impedance and Even-Mode Impedance
        Section 11.10.  Differential and Common Signals and Odd- and Even-Mode Voltage Components
        Section 11.11.  Velocity of Each Mode and Far-End Cross Talk
        Section 11.12.  Ideal Coupled Transmission-Line Model or an Ideal Differential Pair
        Section 11.13.  Measuring Even- and Odd-Mode Impedance
        Section 11.14.  Terminating Differential and Common Signals
        Section 11.15.  Conversion of Differential to Common Signals
        Section 11.16.  EMI and Common Signals
        Section 11.17.  Cross Talk in Differential Pairs
        Section 11.18.  Crossing a Gap in the Return Path
        Section 11.19.  To Tightly Couple or Not to Tightly Couple
        Section 11.20.  Calculating Odd and Even Modes from Capacitance- and Inductance-Matrix Elements
        Section 11.21.  The Characteristic Impedance Matrix
        Section 11.22.  The Bottom Line

     Appendix A.  100 General Design Guidelines to Minimize Signal-Integrity Problems
        Section A.1.  Minimize Signal-Quality Problems on One Net
        Section A.2.  Minimize Cross Talk
        Section A.3.  Minimize Rail Collapse
        Section A.4.  Minimize EMI

     Appendix B.  100 Collected Rules of Thumb to Help Estimate Signal-Integrity Effects
        Section B.1.  Chapter 2
        Section B.2.  Chapter 3
        Section B.3.  Chapter 4
        Section B.4.  Chapter 5
        Section B.5.  Chapter 6
        Section B.6.  Chapter 7
        Section B.7.  Chapter 8
        Section B.8.  Chapter 9
        Section B.9.  Chapter 10
        Section B.10.  Chapter 11

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不错的信号完整性英文书籍(Eric Bogantin)

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不错的信号完整性英文书籍(Eric Bogantin)

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