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发点资料,电容的,讲得很详细As electronic devices get faster, printed circuit boards need to be designed with high speed operation in mind. Consideration must be given to such design issues as power distribution, impedance, crosstalk and EMI, load distribution and board structure (See also “Appnotes: Entering The High-Speed Domain”). Buried CapacitanceTM can be utilized to improve power distribution and reduce EMI emissions in high frequency digital applications.
【文件名】:09314@52RD_bypass capacitor1.doc
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【大 小】:1586K
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