高速PCB基础理论及内存仿真技术

小之未

很好的资料，没有RD啦，所以收1毛钱。呵呵，别介意。
关于PCB设计中Allegro pcb部分很好的仿真资料
讲的很详细。

目 录
第一部分 信号完整性知识基础.................................................................................5
第一章 高速数字电路概述.....................................................................................5
1.1 何为高速电路...............................................................................................5
1.2 高速带来的问题及设计流程剖析...............................................................6
1.3 相关的一些基本概念...................................................................................8
第二章 传输线理论...............................................................................................12
2.1 分布式系统和集总电路.............................................................................12
2.2 传输线的RLCG 模型和电报方程...............................................................13
2.3 传输线的特征阻抗.....................................................................................14
2.3.1 特性阻抗的本质.................................................................................14
2.3.2 特征阻抗相关计算.............................................................................15
2.3.3 特性阻抗对信号完整性的影响.........................................................17
2.4 传输线电报方程及推导.............................................................................18
2.5 趋肤效应和集束效应.................................................................................23
2.6 信号的反射.................................................................................................25
2.6.1 反射机理和电报方程.........................................................................25
2.6.2 反射导致信号的失真问题.................................................................30
2.6.2.1 过冲和下冲.....................................................................................30
2.6.2.2 振荡：.............................................................................................31
2.6.3 反射的抑制和匹配.............................................................................34
2.6.3.1 串行匹配.........................................................................................35
2.6.3.1 并行匹配.........................................................................................36
2.6.3.3 差分线的匹配.................................................................................39
2.6.3.4 多负载的匹配.................................................................................41
第三章 串扰的分析...............................................................................................42
3.1 串扰的基本概念.........................................................................................42
3.2 前向串扰和后向串扰.................................................................................43
3.3 后向串扰的反射.........................................................................................46
3.4 后向串扰的饱和.........................................................................................46
3.5 共模和差模电流对串扰的影响.................................................................48
3.6 连接器的串扰问题.....................................................................................51
3.7 串扰的具体计算.........................................................................................54
3.8 避免串扰的措施.........................................................................................57
第四章 EMI 抑制....................................................................................................60
4.1 EMI/EMC 的基本概念..................................................................................60
4.2 EMI 的产生..................................................................................................61
4.2.1 电压瞬变.............................................................................................61
4.2.2 信号的回流.........................................................................................62
4.2.3 共模和差摸EMI ..................................................................................63
4.3 EMI 的控制..................................................................................................65
4.3.1 屏蔽.....................................................................................................65
ATP 华腾微电子（上海） 高速PCB 基础理论及内存仿真技术 SI 仿真小组
2002-10-252002-10-25 2
4.3.1.1 电场屏蔽.........................................................................................65
4.3.1.2 磁场屏蔽.........................................................................................67
4.3.1.3 电磁场屏蔽.....................................................................................67
4.3.1.4 电磁屏蔽体和屏蔽效率.................................................................68
4.3.2 滤波.....................................................................................................71
4.3.2.1 去耦电容.........................................................................................71
4.3.2.3 磁性元件.........................................................................................73
4.3.3 接地.....................................................................................................74
4.4 PCB 设计中的EMI.......................................................................................75
4.4.1 传输线RLC 参数和EMI ........................................................................76
4.4.2 叠层设计抑制EMI ..............................................................................77
4.4.3 电容和接地过孔对回流的作用.........................................................78
4.4.4 布局和走线规则.................................................................................79
第五章 电源完整性理论基础...............................................................................82
5.1 电源噪声的起因及危害.............................................................................82
5.2 电源阻抗设计.............................................................................................85
5.3 同步开关噪声分析.....................................................................................87
5.3.1 芯片内部开关噪声.............................................................................88
5.3.2 芯片外部开关噪声.............................................................................89
5.3.3 等效电感衡量SSN ..............................................................................90
5.4 旁路电容的特性和应用.............................................................................92
5.4.1 电容的频率特性.................................................................................93
5.4.3 电容的介质和封装影响.....................................................................95
5.4.3 电容并联特性及反谐振.....................................................................95
5.4.4 如何选择电容.....................................................................................97
5.4.5 电容的摆放及Layout ........................................................................99
第六章 系统时序.................................................................................................100
6.1 普通时序系统...........................................................................................100
6.1.1 时序参数的确定...............................................................................101
6.1.2 时序约束条件...................................................................................106
6.2 源同步时序系统.......................................................................................108
6.2.1 源同步系统的基本结构...................................................................109
6.2.2 源同步时序要求...............................................................................110
第七章 IBIS 模型................................................................................................113
7.1 IBIS 模型的由来...................................................................................... 113
7.2 IBIS 与SPICE 的比较.............................................................................. 113
7.3 IBIS 模型的构成...................................................................................... 115
7.4 建立IBIS 模型......................................................................................... 118
7.4 使用IBIS 模型......................................................................................... 119
7.5 IBIS 相关工具及链接..............................................................................120
第八章 高速设计理论在实际中的运用.............................................................122
8.1 叠层设计方案...........................................................................................122
8.2 过孔对信号传输的影响...........................................................................127
8.3 一般布局规则...........................................................................................129
ATP 华腾微电子（上海） 高速PCB 基础理论及内存仿真技术 SI 仿真小组
2002-10-252002-10-25 3
8.4 接地技术...................................................................................................130
8.5 PCB 走线策略............................................................................................134
第二部分：DRAM 内存模块的设计技术..............................................................143
第一章 SDR 和DDR 内存的比较..........................................................................143
第二章 内存模块的叠层设计.............................................................................145
第三章 内存模块的时序要求.............................................................................149
3.1 无缓冲（Unbuffered）内存模块的时序分析.......................................149
3.2 带寄存器（Registered）的内存模块时序分析...................................154
第四章 内存模块信号设计.................................................................................159
4.1 时钟信号的设计.......................................................................................159
4.2 CS 及CKE 信号的设计..............................................................................162
4.3 地址和控制线的设计...............................................................................163
4.4 数据信号线的设计...................................................................................166
4.5 电源，参考电压Vref 及去耦电容.........................................................169
第五章 内存模块的功耗计算.............................................................................172
第六章 实际设计案例分析.................................................................................178
第三部分 SPECCTRAQUEST 仿真指南...........................................................188
第一章 CADENCE SPECCTRAQUEST 的简介...............................................................188
1.1 SPECCTRAQuest SI Expert.....................................................................189
1.2 SPECCTRAQuest Power Integrity.........................................................189
1.3 SPECCTRAQuest for IC Packaging.......................................................189
1.4 SPECCTRAQuest Signal Explorer.........................................................189
第二章 CADENCE SPECCTRAQUEST 的基本运用.................................................190
2.1 仿真前的准备工作...................................................................................190
2.1.1 获取元件的IBIS 模型.....................................................................190
2.1.2 转换IBIS 文件格式及调入模型.....................................................190
2.1.3 给元件加载对应的模型...................................................................192
2.1.4 定义电源电压...................................................................................194
2.1.5 PCB 叠层设置....................................................................................195
2.1.6 仿真参数的确定...............................................................................196
2.2 设计后仿真的过程...................................................................................197
2.2.1 确定准备工作已经做好...................................................................198
2.2.2 选择信号线.......................................................................................198
2.2.3 提取电路拓扑结构...........................................................................199
2.2.4 选择不同的驱动激励和元件参数进行仿真...................................200
2.2.5 仿真结果的分析...............................................................................201
2.2.6 SigWave 的使用................................................................................202
2.2.7 后仿真的收尾工作...........................................................................203
2.2.8 一些补充...........................................................................................203
2.3 设计前仿真的过程...................................................................................204
2.3.1 布局前的前仿真...............................................................................204
2.3.2 布局后的前仿真.................................................................................207
第三章 SPECCTRAQUEST SI EXPERT 的进阶运用..................................................209
ATP 华腾微电子（上海） 高速PCB 基础理论及内存仿真技术 SI 仿真小组
2002-10-252002-10-25 4
3.1 高速系统级设计和分析...........................................................................209
3.2 高速设计的问题.......................................................................................209
3.3 SPECCTRAQuest SI Expert 的组件.......................................................210
3.3.1 SPECCTRAQuest Model Integrity .................................................210
3.3.2 SPECCTRAQuest Floorplanner/Editor .........................................215
3.3.3 Constraint Manager .......................................................................216
3.3.4 SigXplorer Expert Topology Development Environment .......223
3.3.5 SigNoise 仿真子系统......................................................................225
3.3.6 EMControl .........................................................................................230
3.3.7 SPECCTRA Expert 自动布线器.......................................................230
3.4 高速设计的大致流程...............................................................................230
3.4.1 拓扑结构的探索...............................................................................231
3.4.2 空间解决方案的探索.......................................................................231
3.4.3 使用拓扑模板驱动设计...................................................................231
3.4.4 时序驱动布局...................................................................................232
3.4.5 以约束条件驱动设计.......................................................................232
3.4.6 设计后分析.......................................................................................233
第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................234
4.1 SPECCTRAQuest Signal Explorer 的功能包括：................................234
4.2 图形化的拓扑结构探索...........................................................................234
4.3 全面的信号完整性(Signal Integrity)分析.......................................234
4.4 完全兼容 IBIS 模型...............................................................................234
4.5 PCB 设计前和设计的拓扑结构提取.......................................................235
4.6 仿真设置顾问...........................................................................................235
4.7 改变设计的管理.......................................................................................235
4.8 关键技术特点...........................................................................................236
4.8.1 拓扑结构探索...................................................................................236
4.8.2 SigWave 波形显示器........................................................................236
4.8.3 集成化的在线分析(Integration and In-process Analysis) .236
第五章 部分特殊的运用...............................................................................237
5.1 Script 指令的使用..................................................................................237
5.2 差分信号的仿真.......................................................................................243
5.3 眼图模式的使用.......................................................................................249
第四部分：HYPERLYNX 仿真工具使用指南............................................................251
第一章 使用LINESIM 进行前仿真.......................................................................251
1.1 用LineSim 进行仿真工作的基本方法...................................................251
1.2 处理信号完整性原理图的具体问题.......................................................259
1.3 在LineSim 中如何对传输线进行设置...................................................260
1.4 在LineSim 中模拟IC 元件.....................................................................263
1.5 在LineSim 中进行串扰仿真...................................................................268
第二章 使用BOARDSIM 进行后仿真......................................................................273
2.1 用BOARDSIM 进行后仿真工作的基本方法...................................................273
2.2 BoardSim 的进一步介绍..........................................................................292
2.3 BoardSim 中的串扰仿真..........................................................................309
ATP 华腾微电子（上海） 高速PCB 基础理论及内存仿真技术 SI 仿真小组
2002-10-252002-10-25 5
参考书目...................................................................................................................314
附录一 关于EMI 的一些分类.............................................................................317
附录二 常见多层板叠层方案...............................................................................320
附录三 内存多层PCB 叠层参数参考.................................................................324
附录四 CADENCE SPECCTRAQUEST 菜单说明..........................................339

whx057

怎么没有东西啊？
[em13]

ken_2008

没有看到附件啊

zjiong

[em11][em11][em11]

小之未

【文件名】:09412@52RD_高速PCB基础理论及内存仿真技术 .part1.rar
【格　式】:rar
【大　小】:3145K
【简　介】:
【目　录】:见上
[UseMoney=2]

zsl529zjb

学习       谢谢！

changlewang

感觉是个好东西